fbpx

Prof. Ibrahim Mohammad Elfadel

Prof. Ibrahim Mohammad Elfadel

Ibrahim (Abe) M. Elfadel is Professor of Electrical Engineering and Computer Science at Khalifa University, Abu Dhabi, UAE. He is also affiliated with the Khalifa University Center for Cyber Physical Systems. Prior to his current position, he was Professor of Electrical Engineering and Computer Science at the Masdar Institute of Science and Technology, Abu Dhabi, UAE.  Between May 2013 and April 2018, he served as the founding co-director of the Abu Dhabi SRC Center of Excellence on Energy-Efficient Electronic Systems (ACE4S). From May 2014 until April 2018, he served as the Program Manager of Mubadala’s TwinLab MEMS, a joint collaboration with the Institute of Microelectronics in Singapore on MEMS. Between Nov 2012 and Oct 2015, he was the founding director of Mubadala’s TwinLab 3DSC, a joint research center on 3D integrated circuits with the Technical University of Dresden, Germany. He also headed the Masdar Institute Center for Microsystems (iMicro) from Nov 2013 until Mar 2016. Between 1996 and 2010, he was with the corporate CAD organizations at IBM Research and the IBM Systems and Technology Group, Yorktown Heights, NY, where he was involved in the research, development, and deployment of CAD tools and methodologies for IBM’s high-end microprocessors.  Dr. Elfadel is the recipient of six Invention Achievement Awards, one Outstanding Technical Achievement Award and one Research Division Award, all from IBM, for his contributions in the area of VLSI CAD.  He is the inventor or co-inventor of 55 issued US patents with many internationally filed and several pending, and the author or co-author of more than 130 archival articles.  In 2014, he was the co-recipient of the D. O. Pederson Best Paper Award from the IEEE Transactions on Computer-Aided Design for Integrated Circuits and Systems. In 2018, he received the Board of Director Recognition Award from the Semiconductor Research Corporation, USA, for “Pioneering Semiconductor Research in Abu Dhabi.” Dr. Elfadel is the co-editor (with Prof. Gerhard Fettweis) of “3D Stacked Chips: From Emerging Processes to Heterogeneous Systems,” Springer, 2016, and the co-editor (with Prof. Mohammad Ismail) of “The IoT Physical Layer: Design and Implementation,” Springer, 2019. Between 2009 and 2013, Dr. Elfadel served as an Associate Editor of the IEEE Transactions on Computer-Aided Design and is currently serving as Associate Editor of the IEEE Transactions on VLSI and on the Editorial Board of the Microelectronics Journal (Elsevier).  Dr. Elfadel has served on the Technical Program Committees of DAC, ICCAD, ASPDAC, DATE, ICCD, ICECS, MWSCAS, and VLSI-SoC. He was the General Co-chair of the IFIP/IEEE  25th International Conference on Very Large Scale Integration (VLSI-SoC), Abu Dhabi, UAE, October 2017.

  • MSc, Massachusetts Institute of Technology, USA, 1986
  • PhD, Massachusetts Institute of Technology, USA, 1993
  • Digital System Design
  • Computer Architecture
  • Microprocessor Systems
  • Digital Signal Processing
  • Design and Fabrication of MEMS
  • Computer-Aided Design of Microelectronic Systems
  • Numerical Simulation of Circuits and Systems
  • High-Performance Computing
  • Cyber Physical Systems
  • Cloud and Edge Computing
  • IoT Platform Prototyping
  • Embedded Digital Signal Processing
  • Computer-Aided Design for VLSI, MEMS, and Photonics
  • 3D Integrated Circuits
  • Micro Power Sources

Books:

  • M. Elfadel, D. S. Boning, and X. Li, Eds., “Machine Learning in VLSI Computer-Aided Design,” Springer, 2019. ISBN 978-3-030-04665-1.
  • M. Elfadel and M. Ismail, Eds., “The IoT Physical Layer: Design and Implementation,” Springer, 2019. ISBN 978-3-319-93100-5.
  • I. M. Elfadel and G. Fettweis, Eds., “3D Stacked Chips: From Emerging Processes to Heterogeneous Systems,” Springer, 2016. ISBN 978-3-319-20480-2.

Recent Journal Articles:

  • Syed and I. M. Elfadel, “Vibrational Model of a Prismatic Multilayered Tapered Cantilever Using Perturbation Analysis,” Elsevier’s Journal of Sound and Vibration, Vol. 441, pp. 1 – 25, Feb 2019.
  • Karn, P. Kudva, and I. M. Elfadel, “Dynamic Autoselection and Autotuning of Machine Learning Models for Cloud Network Analytics,” IEEE Transactions on Parallel and Distributed Systems, Oct 2018. Early Access.
  • Syed, A. Bojesomo, and I. M. Elfadel, “Electromechanical Model of a
  • Tapered Piezoelectric Energy Harvester,” IEEE Sensors Journal, Vol. 18, No. 14, pp. 5853-5862, Jul 2018.
  • Mohammed, I. M. Elfadel, and M. Rasras, “Monolithic Multi Degree of Freedom Capacitive MEMS Accelerometers”, Micromachines, Vol. 9, No. 11, pp. 602 – 621, Nov 2018.
  • Knechtel, J. Leinig, and I. M. Elfadel, “Voltage Domain Assignment in 3D IC Physical Design,” ACM Transactions on Design Automation of Electronic Systems. Vol. 23, No. 2, pp. 22:1 – 22:25, Jan 2018.
  • Syed, O. Brimmo, O. Waheed, A. Bojesomo, M. Ibrahim Ali, S. Chengliang, I. Ocak, A. Chatterjee, and I. M. Elfadel, “Numerical Modeling and Validation of Squeezed Film Damping in Vacuum-packaged, Industrial MEMS,” Journal of Micromechanics and Microengineering. Vol. 27. No. 7, pp. 075016, Jun 2017.
  • Yang, H. Li, I. M. Elfadel, A. Chatterjee, I. Ocak, T.J. Zhang, “A Novel Approach to the Analysis of Squeezed-Film Air Damping in MEMS,” Journal of Micromechanics and Microengineering, Vol. 27, No. 1, pp. 015012, Jan 2017.
  • Yu, L., Saxena, S., Hess, C., Elfadel, I. M., Antoniadis, D., and Boning, D., “Compact Model Parameter Extraction Using Bayesian Inference, Incomplete New Measurements, and Optimal Bias Selection,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. Vol 35, No 7, pp. 1138-1150, Jul 2016.

Recent Refereed Conference Papers:

  • Muzaffar and I. M. Elfadel, “An Instruction Set Architecture for Low-power, Dynamic IoT Communication,” 26th IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC 2018), Verona, Italy, Oct 8 – 10, 2018. To appear.
  • Syed, A. Bojesomo, A., and I. M. Elfadel, “Variation-aware modelling of microscale piezoelectric energy harvesters,” 20th Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2018), Rome, Italy, pp. 1-4, May 23 – 25, 2018.
  • Bojesomo, W. Syed, and I. M. Elfadel, “On the modelling and placement of bonding-pillar holes in multi-wafer, vacuum-packaged MEMS,” 20th IEEE Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2018), Rome, Italy, pp. 1 – 4, May 23 – 25, 2018.
  • Mohammed, I. M. Elfadel, and M. Rasras,”High dynamic range Z-axis hybrid-spring MEMS capacitive accelerometer,” 20th IEEE Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2018), Rome, Italy, pp. 1 – 4, May 23 – 25, 2018.
  • Waheed and I. M. Elfadel, “FPGA sensor fusion system design for IMU arrays,” 20th IEEE Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2018), Rome, Italy, pp. 1 – 4, May 23 – 25, 2018.
  • Muzaffar and I. M. Elfadel,”A pulsed decimal technique for single-channel, dynamic signaling for IoT applications,” 20th IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC 2018), Abu Dhabi, UAE, pp. 1 – 6, Oct 23 – 25, 2017.
  • Muzaffar, O. Waheed, Z. Aung, and I. M. Elfadel, “Single-clock-cycle, multilayer encryption algorithm for single-channel IoT communications,” 2017 IEEE Conference on Dependable and Secure Computing, Taipei, Taiwan, pp. 153 – 58, Aug 7-10, 2017.
  • Sinding, I. E. Ocak, W. Syed, N. Chatterjee, C. Welham, S. Liu, Yan, S. Breit, S., H.-K. Chang, I. M. Elfadel, and A, Sbiaa, “Corrected squeezed-film damping simulation validated with a lorentz-force magnetometer operating in vacuum,” 30th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2017), Las Vegas, NV, pp. 889-892, Jan 22-26, 2017.
  • Sinding, A. Parent, I. E. Ocak, W. Syed, N. Chatterjee, C. Welham, S. Liu, J. Yan, S. Breit, S., H.-K. Chang, I. M. Elfadel, and A. Sbiaa, “A novel squeezed-film damping model for MEMS comb structures,” 19th  International Conference on Solid-State Sensors, Actuators and Microsystems, (TRANSDUCERS 2017), Kaohsiung, Taiwan, pp. 2095-2098, Jun 18 – 22, 2017.

Selected Book Chapters:

  • A. Elian, N. Sada, I. M. Elfadel, M. Saeed and A. Shabra, “A Preliminary Evaluation of Continuous, Shoe-Integrated Weight Measurements for Heart Failure Patients,” in I. M. Elfadel and M. Ismail, Eds., The IoT Physical Layer: Design and Implementation, Springer, 2019.
  • O. T. Waheed, A. Elian, I. M. Elfadel and A. Shabra, “Time-delay Array Beamforming for Millimeter Wave IoT Systems,” in I. M. Elfadel and M. Ismail, Eds., The IoT Physical Layer: Design and Implementation, Springer, 2019.
  • S. Muzaffar and I. M. Elfadel, “Low-power, Dynamic-data-rate Protocol for IoT Communication,” in I. M. Elfadel and M. Ismail, Eds., The IoT Physical Layer: Design and Implementation, Springer, 2019.
  • S. Muzaffar and I. M. Elfadel, “An Integrated, Low-power Platform for Continuous Congestive Heart-failure Monitoring,” in I. M. Elfadel and M. Ismail, Eds., The IoT Physical Layer: Design and Implementation, Springer, 2019.

Selected Patents:

  • US Patent 9,317,644, “Generating capacitance look-up tables for wiring patterns in the presence of metal fills,” Inventors: I. M. Elfadel, T. El Moselhy, and D. Widiger. Issued: April 19, 2016.
  • US Patent 8,897,062. “Memory programming for a phase change memory.” Inventors: M. Breitwisch, Cheek, S. Chiras, I. M. Elfadel, M. Franceschini, J. Karidis, L. Lastras-Montano, and M. Sharma. Issued: November 25, 2014.
  • US Patent 8,407,632. “Detecting Dose and Focus During Lithography.” Inventors: I. M. Elfadel, Y. Liu, S. Polonsky, and A. Singhee, Issued: March 26, 2013.
  • US Patent 8,239,804. “Method for Calculating Capacitance Gradients in VLSI Layouts Using a Shape Processing Engine.” Inventors: I. M. Elfadel, T. El Moselhy, D. Widiger, L. Dewey III, and P. Williams. Issued: August 7, 2012.
  • US Patent 8,201,122. “Computing Resistance Sensitivities with Respect to Geometric Parameters of Conductors with Arbitrary Shapes.” Inventors: L. Dewey III, I. M. Elfadel, and T. El Moselhy. Issued: June 12, 2012.
  • US Patent 7,913,202. \Wafer Level I/O Test and Repair Enabled by I/O Layer.” Inventors: K. Bernstein, P. Coteus, I. M. Elfadel, P. Emma, D. Friedman, R. Puri, M. Ritter, J. Trewhella, and A. M. Young, Issued: Mars 22, 2011.
  • US Patent 7,827,019. “Method for Order Selection in Passive Transmission Line Macromodels Based on the Lie Criterion.” Inventors: I. M. Elfadel and H. Huang. Issued: November 2, 2010.
  • US Patent 7,723,207. “Three Dimensional Integrated Circuit and Method of Design.” Inventors: S. M. Alam, I. M. Elfadel, K. Guarini, M. Ieong, P. Kudva, D. S. Kung, M. Lavin, and A. Rahman. Issued: May 25, 2010.

Good Oldies:

  • I. M. Elfadel, “Convex Potentials and their Conjugates in Analog Mean-Field Optimization,” Neural Computation, Vol. 7, pp. 1079 – 1104, 1995.
  • J. L. Wyatt, Jr. and I. M. Elfadel, “Time-Domain Solutions of Oja’s Equations,” Neural Computation, Vol. 7, pp. 915 – 922, 1995.
  • I. M. Elfadel and R. W. Picard, “Gibbs Random Fields, Co-Occurrences, and Texture Modeling,” IEEE Trans. Pattern Analysis and Machine Intelligence, Vol. 16, pp. 24-37, 1994.
  • I. M. Elfadel and A. L. Yuille, “Mean-Field Phase Transitions and Correlation Functions for Gibbs Random Fields,” Jour. Mathematical Imaging and Vision, Vol. 2, pp. 167-186. 1993.
  • R. W. Picard and I. M. Elfadel, “On the Structure of Aura and Co-occurrence Matrices for the Gibbs Texture Model,” Jour. Mathematical Imaging and Vision, Vol. 2, pp. 5-25. 1992.
  • A. Lumsdaine, J. L. Wyatt, Jr., and I. M. Elfadel, “Nonlinear Analog Networks for Image Smoothing and Segmentation,” Journal of VLSI Signal Processing, Vol. 3, pp. 53-68, 1991.

New to site? Create an Account


Login

Lost password? (close)

Already have an account? Login


Signup

(close)